JPH0221086B2 - - Google Patents
Info
- Publication number
- JPH0221086B2 JPH0221086B2 JP9872482A JP9872482A JPH0221086B2 JP H0221086 B2 JPH0221086 B2 JP H0221086B2 JP 9872482 A JP9872482 A JP 9872482A JP 9872482 A JP9872482 A JP 9872482A JP H0221086 B2 JPH0221086 B2 JP H0221086B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- parts
- epoxy resin
- curing
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 22
- 239000003822 epoxy resin Substances 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 15
- 229920000647 polyepoxide Polymers 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 13
- 125000002723 alicyclic group Chemical group 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 7
- -1 alicyclic acid anhydride Chemical class 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 6
- 150000002148 esters Chemical class 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000004804 winding Methods 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 230000000052 comparative effect Effects 0.000 description 11
- 238000001723 curing Methods 0.000 description 10
- 239000000945 filler Substances 0.000 description 9
- 239000000377 silicon dioxide Substances 0.000 description 9
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000004062 sedimentation Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 229920003319 Araldite® Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- ZOQVDXYAPXAFRW-UHFFFAOYSA-N 2,5-diethyl-1h-imidazole Chemical compound CCC1=CNC(CC)=N1 ZOQVDXYAPXAFRW-UHFFFAOYSA-N 0.000 description 1
- HJVAFZMYQQSPHF-UHFFFAOYSA-N 2-[bis(2-hydroxyethyl)amino]ethanol;boric acid Chemical compound OB(O)O.OCCN(CCO)CCO HJVAFZMYQQSPHF-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- MLRJVBMVSTYSFC-UHFFFAOYSA-N C1(CC2C(CC1)O2)CCCO[Si](C)(C)C Chemical compound C1(CC2C(CC1)O2)CCCO[Si](C)(C)C MLRJVBMVSTYSFC-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- KTPIWUHKYIJBCR-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohex-4-ene-1,2-dicarboxylate Chemical compound C1C=CCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 KTPIWUHKYIJBCR-UHFFFAOYSA-N 0.000 description 1
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 description 1
- XQTLTZXGLRMUQI-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,3-dicarboxylate Chemical compound C1CCC(C(=O)OCC2OC2)CC1C(=O)OCC1CO1 XQTLTZXGLRMUQI-UHFFFAOYSA-N 0.000 description 1
- HGXHJQLDZPXEOG-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,4-dicarboxylate Chemical compound C1CC(C(=O)OCC2OC2)CCC1C(=O)OCC1CO1 HGXHJQLDZPXEOG-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- RIWRFSMVIUAEBX-UHFFFAOYSA-N n-methyl-1-phenylmethanamine Chemical compound CNCC1=CC=CC=C1 RIWRFSMVIUAEBX-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
- Insulating Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9872482A JPS58214225A (ja) | 1982-06-07 | 1982-06-07 | 樹脂被覆電気装置の製造法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9872482A JPS58214225A (ja) | 1982-06-07 | 1982-06-07 | 樹脂被覆電気装置の製造法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58214225A JPS58214225A (ja) | 1983-12-13 |
JPH0221086B2 true JPH0221086B2 (en]) | 1990-05-11 |
Family
ID=14227462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9872482A Granted JPS58214225A (ja) | 1982-06-07 | 1982-06-07 | 樹脂被覆電気装置の製造法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58214225A (en]) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3339083B2 (ja) * | 1992-10-27 | 2002-10-28 | 新日本理化株式会社 | エポキシ樹脂組成物 |
TWI734686B (zh) * | 2015-05-19 | 2021-08-01 | 瑞士商亨斯邁先進材料授權(瑞士)有限公司 | 熱固性環氧樹脂之固化劑及製備電機工程用絕緣系統的方法 |
-
1982
- 1982-06-07 JP JP9872482A patent/JPS58214225A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58214225A (ja) | 1983-12-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103649158B (zh) | 绝缘制剂 | |
CN102725802A (zh) | 电绝缘体系 | |
CN102428124A (zh) | 可固化环氧树脂组合物 | |
JP2014518921A (ja) | 絶縁配合物 | |
BRPI0722152A2 (pt) | Sistema de isolamento elétrico de concreto polimérico | |
JPH02117914A (ja) | エポキシ樹脂組成物 | |
CN107418147A (zh) | 一种憎水性电气绝缘环氧树脂组合物 | |
JPS58198525A (ja) | エポキシ樹脂組成物 | |
JP6686071B2 (ja) | エポキシ樹脂組成物及びこれを含む変圧器 | |
JPH0221086B2 (en]) | ||
JPS58225121A (ja) | エポキシ樹脂組成物及びそれを用いる電子部品の封止方法 | |
JPS6249292B2 (en]) | ||
JPS6119620A (ja) | 液状エポキシ樹脂組成物 | |
JP4322047B2 (ja) | 電気絶縁用注型エポキシ樹脂組成物及び硬化物 | |
JP2001288334A (ja) | モールドコイル及びその製造方法 | |
JP3872038B2 (ja) | 注形用エポキシ樹脂組成物、その硬化方法及び電気・電子部品装置 | |
JP2001135144A (ja) | Sf6ガス絶縁機器用注型品およびその製造方法 | |
JP3115693B2 (ja) | エポキシ樹脂組成物および半導体封止装置 | |
JP6263392B2 (ja) | 液状樹脂組成物、電気部品及びその製造方法 | |
KR880001519B1 (ko) | 에폭시 수지 조성물 | |
JPH039929B2 (en]) | ||
JPS58213018A (ja) | エポキシ樹脂組成物 | |
JPH0725992B2 (ja) | エポキシ樹脂組成物とその製造方法 | |
JPH0925328A (ja) | エポキシ樹脂組成物および半導体封止装置 | |
JPS6341935B2 (en]) |